一种陶瓷件用于处理半导体衬底的真空处理室，具有才机加工或才烧结的外表面的非氧化物陶瓷材料；和在该外表面上并形成陶瓷件的外表面的氧化层，该氧化层内包含附着在外表面上的非氧化物陶瓷材料颗粒。
在半导体衬底处理期间，使陶瓷件经等离子体调控处理可使颗粒污染降至低。陶瓷件可由各种材料制成，如氧化铝、二氧化硅、石英、碳、硅、碳化硅、氮化硅、氮化硼、碳化硼、氮化铝或碳化钛。
陶瓷件可为真空处理室的各种部件，如处理室侧壁内的衬套、向处理室供给处理气体的气体散布板、喷淋头组件的缓冲板、晶片通道插入件、衬底周围的聚焦环、电极周围的边环、等离子体屏蔽板和/或窗口。（图/文www.cddnvga.cn）
中译英：
A ceramic pieces for processing a semiconductor substrate vacuum processing chamber, high machining or sintering of the outer surface of the ceramic material; and on the outer surface and the formation of ceramic parts and the external surface of the oxide layer, the oxide layer contains attached at the external surface of the non oxide ceramic material particle.

During processing of semiconductor substrates, ceramic parts by plasma treatment to control particle contamination can be minimized. The ceramic part can be made from a variety of materials, such as alumina, silica, quartz, carbon, silicon, silicon carbide, silicon nitride, boron nitride, boron carbide, aluminum nitride or titanium carbide.